TI SN74LV02AD

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Description

          SCLS390J − APRIL 1998 − REVISED APRIL 2005

D 2-V to 5.5-V VCC Operation D Max tpd of 6.5 ns at 5 V D Typical VOLP (Output Ground Bounce)

13

3

12

4

11

5

10

6

9

7

8

1A 1B 2Y 2A 2B

14

1A 1Y NC VCC 4Y

1 2

13 4Y

3

12 4B

4

11 4A

5

10 3Y 9 3B

6 7

8

SN54LV02A . . . FK PACKAGE (TOP VIEW)

1B NC 2Y NC 2A

4

3 2 1 20 19 18

5

17

6

16

7

15

8

14 9 10 11 12 13

4B NC 4A NC 3Y

2B GND NC 3A 3B

2

VCC 4Y 4B 4A 3Y 3B 3A

VCC

14

3A

1

Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101)

SN74LV02A . . . RGY PACKAGE (TOP VIEW)

SN54LV02A . . . J OR W PACKAGE SN74LV02A . . . D, DB, DGV, NS, OR PW PACKAGE (TOP VIEW)

1Y 1A 1B 2Y 2A 2B GND

D

1Y

D

D

2.3 V at VCC = 3.3 V, TA = 25°C Support Mixed-Mode Voltage Operation on All Ports

GND

D

D Ioff Supports Partial-Power-Down Mode

NC − No internal connection

description/ordering information The ’LV02A devices are quadruple 2-input positive-NOR gates designed for 2-V to 5.5-V VCC operation. The ’LV02A devices perform the Boolean function Y = A + B or Y = A • B in positive logic. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. ORDERING INFORMATION

QFN − RGY

SN74LV02ARGYR

Tube of 50

SN74LV02AD

Reel of 2500

SN74LV02ADR

SOP − NS

Reel of 2000

SN74LV02ANSR

74LV02A

SSOP − DB

Reel of 2000

SN74LV02ADBR

LV02A

Tube of 90

SN74LV02APW

Reel of 2000

SN74LV02APWR

TSSOP − PW

−55°C −55 C to 125 125°C C

TOP-SIDE MARKING

Reel of 1000

SOIC − D

−40°C −40 C to 85 85°C C

ORDERABLE PART NUMBER

PACKAGE†

TA

LV02A LV02A

LV02A

Reel of 250

SN74LV02APWT

TVSOP − DGV

Reel of 2000

SN74LV02ADGVR

LV02A

CDIP − J

Tube of 25

SNJ54LV02AJ

SNJ54LV02AJ

CFP − W

Tube of 150

SNJ54LV02AW

SNJ54LV102AW

LCCC − FK

Tube of 55

SNJ54LV02AFK

SNJ54LV02AFK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2005, Texas Instruments Incorporated

    !"#$ $%$  &   $'("%$ !((#$ % ' )!*+%$ %#, (! $'("  )#'%$ )#( # #(" ' #-% $(!"#$ %$%( .%((%$/, (!$ )(#$0 # $ $##%(+/ $+!# #$0 ' %++ )%(%"##(, POST OFFICE BOX 655303

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1

          SCLS390J − APRIL 1998 − REVISED APRIL 2005

FUNCTION TABLE (each gate) INPUTS A

B

OUTPUT Y

H

X

L

X

H

L

L

L

H

logic diagram (positive logic) A

Y

B

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W (see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W (see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W (see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W (see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 4. The package thermal impedance is calculated in accordance with JESD 51-5.

2

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          SCLS390J − APRIL 1998 − REVISED APRIL 2005

recommended operating conditions (see Note 5) SN54LV02A VCC

VIH

High-level input voltage

VIL

Low-level input voltage

VI VO

Input voltage

IOH

IOL

∆t/∆v

MIN

MAX

2

5.5

Supply voltage VCC = 2 V VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V

1.5

2

5.5

VCC × 0.7 VCC × 0.7

VCC × 0.7

VCC × 0.7

Output voltage

UNIT V

V

0.5

0.5

VCC × 0.3 VCC × 0.3

VCC × 0.3 VCC × 0.3

VCC × 0.3 5.5

0 0

0

VCC −50

VCC = 2 V VCC = 2.3 V to 2.7 V

VCC × 0.3 5.5

0

VCC −50

−2

VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V

V

V V µA

−2

−6

−6

−12

−12

VCC = 2 V VCC = 2.3 V to 2.7 V

50

50

2

2

VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V

6

6

12

12

200

200

100

100

20

20

VCC = 2.3 V to 2.7 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V

Input transition rise or fall rate

MAX

VCC × 0.7 VCC × 0.7

VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V

Low-level output current

MIN 1.5

VCC = 2 V VCC = 2.3 V to 2.7 V

High-level output current

SN74LV02A

mA µA mA

ns/V

TA Operating free-air temperature −55 125 −40 85 °C NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) SN54LV02A PARAMETER

VOH

VOL

TEST CONDITIONS IOH = −50 µA IOH = −2 mA

IOL = 50 µA IOL = 2 mA IOL = 6 mA IOL = 12 mA VI = 5.5 V or GND VI = VCC or GND,

Ioff Ci

VI or VO = 0 to 5.5 V VI = VCC or GND

MIN

2 V to 5.5 V

IOH = −6 mA IOH = −12 mA

II ICC

VCC

IO = 0

TYP

SN74LV02A MAX

MIN

2.3 V

VCC−0.1 2

VCC−0.1 2

3V

2.48

2.48

4.5 V

3.8

TYP

MAX

UNIT

V

3.8

2 V to 5.5 V

0.1

0.1

2.3 V

0.4

0.4

3V

0.44

0.44

4.5 V

V

0.55

0.55

0 V to 5.5 V

±1

±1

µA

5.5 V

20

20

µA

0

5

5

µA

3.3 V

1.6

1.6

pF

 &  $'("%$ $#($ )(! $ # '("%1# ( #0$ )%# ' #1#+)"#$, &%(%#( %% %$ #( )#'%$ %(# #0$ 0%+, #-% $(!"#$ (##(1# # (0  %$0# ( $$!# ## )(! .! $#,

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3

          SCLS390J − APRIL 1998 − REVISED APRIL 2005

switching characteristics over recommended operating VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1) PARAMETER

FROM (INPUT)

TO (OUTPUT)

tpd

A or B

Y

LOAD CAPACITANCE

MIN

free-air

TA = 25°C TYP MAX

temperature

SN54LV02A

range,

SN74LV02A

MIN

MAX

MIN

MAX

CL = 15 pF

8.3*

12.4*

1*

15*

1

15

CL = 50 pF

11

16.1

1

19

1

19

UNIT ns

* On products compliant to MIL-PRF-38535, this parameter is not production tested.

switching characteristics over recommended operating VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER

FROM (INPUT)

TO (OUTPUT)

tpd

A or B

Y

free-air

LOAD CAPACITANCE

TA = 25°C MIN TYP MAX

CL = 15 pF

5.6*

CL = 50 pF

7.6

temperature

SN54LV02A

range,

SN74LV02A

MIN

MAX

MIN

MAX

7.9*

1*

9.5*

1

9.5

11.4

1

13

1

13

UNIT ns

* On products compliant to MIL-PRF-38535, this parameter is not production tested.

switching characteristics over recommended operating VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER

FROM (INPUT)

TO (OUTPUT)

tpd

A or B

Y

LOAD CAPACITANCE

MIN

free-air

TA = 25°C TYP MAX

temperature

SN54LV02A

range,

SN74LV02A

MIN

MAX

MIN

MAX

CL = 15 pF

3.9*

5.5*

1*

6.5*

1

6.5

CL = 50 pF

5.3

7.5

1

8.5

1

8.5

UNIT ns

* On products compliant to MIL-PRF-38535, this parameter is not production tested.

noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6) SN74LV02A PARAMETER

MIN

TYP

MAX

UNIT

VOL(P) VOL(V)

Quiet output, maximum dynamic VOL

0.2

0.8

V

Quiet output, minimum dynamic VOL

−0.1

−0.8

V

VOH(V) VIH(D)

Quiet output, minimum dynamic VOH

3.2

High-level dynamic input voltage

V

2.31

V

VIL(D) Low-level dynamic input voltage NOTE 6: Characteristics are for surface-mount packages only.

0.99

V

VCC 3.3 V

TYP

UNIT

5V

10.3

operating characteristics, TA = 25°C PARAMETER Cpd

Power dissipation capacitance

TEST CONDITIONS CL = 50 pF,

 &  $'("%$ $#($ )(! $ # '("%1# ( #0$ )%# ' #1#+)"#$, &%(%#( %% %$ #( )#'%$ %(# #0$ 0%+, #-% $(!"#$ (##(1# # (0  %$0# ( $$!# ## )(! .! $#,

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f = 10 MHz

8.9 pF

          SCLS390J − APRIL 1998 − REVISED APRIL 2005

PARAMETER MEASUREMENT INFORMATION

From Output Under Test

RL = 1 kΩ

From Output Under Test

Test Point

VCC Open

S1

TEST

GND

CL (see Note A)

CL (see Note A)

S1

tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain

Open VCC GND VCC

LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS

LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS

VCC 50% VCC

Timing Input

0V

tw tsu

VCC 50% VCC

Input

50% VCC

th VCC 50% VCC

Data Input

50% VCC

0V

0V

VOLTAGE WAVEFORMS PULSE DURATION

VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC

50% VCC

Input

50% VCC

tPLH In-Phase Output

tPHL 50% VCC

tPHL Out-of-Phase Output

0V

VOH 50% VCC VOL

50% VCC

VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS

50% VCC

50% VCC 0V tPLZ

tPZL Output Waveform 1 S1 at VCC (see Note B)

tPLH VOH 50% VCC VOL

VCC

Output Control

≈VCC 50% VCC

tPHZ

tPZH Output Waveform 2 S1 at GND (see Note B)

VOL + 0.3 V VOL

50% VCC

VOH − 0.3 V

VOH ≈0 V

VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING

NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time, with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. H. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms

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5

PACKAGE OPTION ADDENDUM www.ti.com

9-Aug-2005

PACKAGING INFORMATION Orderable Device

Status (1)

Package Type

Package Drawing

Pins Package Eco Plan (2) Qty

SN74LV02AD

ACTIVE

SOIC

D

14

SN74LV02ADBR

ACTIVE

SSOP

DB

SN74LV02ADBRE4

ACTIVE

SSOP

SN74LV02ADE4

ACTIVE

SN74LV02ADGVR

50

Lead/Ball Finish

MSL Peak Temp (3)

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

14

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

DB

14

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SOIC

D

14

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

ACTIVE

TVSOP

DGV

14

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02ADGVRE4

ACTIVE

TVSOP

DGV

14

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02ADR

ACTIVE

SOIC

D

14

2500 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02ADRE4

ACTIVE

SOIC

D

14

2500 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02ANSR

ACTIVE

SO

NS

14

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02ANSRE4

ACTIVE

SO

NS

14

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02APW

ACTIVE

TSSOP

PW

14

90

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02APWE4

ACTIVE

TSSOP

PW

14

90

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02APWG4

ACTIVE

TSSOP

PW

14

90

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02APWR

ACTIVE

TSSOP

PW

14

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02APWRE4

ACTIVE

TSSOP

PW

14

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02APWRG4

ACTIVE

TSSOP

PW

14

2000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02APWT

ACTIVE

TSSOP

PW

14

250

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02APWTE4

ACTIVE

TSSOP

PW

14

250

Green (RoHS & no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74LV02ARGYR

ACTIVE

QFN

RGY

14

1000 Green (RoHS & no Sb/Br)

CU NIPDAU

Level-2-260C-1YEAR

50

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com

9-Aug-2005

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000

DGV (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

24 PINS SHOWN

0,40

0,23 0,13

24

13

0,07 M

0,16 NOM 4,50 4,30

6,60 6,20

Gage Plane

0,25 0°–8° 1

0,75 0,50

12 A

Seating Plane 0,15 0,05

1,20 MAX

PINS **

0,08

14

16

20

24

38

48

56

A MAX

3,70

3,70

5,10

5,10

7,90

9,80

11,40

A MIN

3,50

3,50

4,90

4,90

7,70

9,60

11,20

DIM

4073251/E 08/00 NOTES: A. B. C. D.

All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194

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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

28 PINS SHOWN 0,38 0,22

0,65 28

0,15 M

15

0,25 0,09 8,20 7,40

5,60 5,00

Gage Plane 1

14

0,25

A

0°–ā8°

0,95 0,55

Seating Plane 2,00 MAX

0,10

0,05 MIN

PINS **

14

16

20

24

28

30

38

A MAX

6,50

6,50

7,50

8,50

10,50

10,50

12,90

A MIN

5,90

5,90

6,90

7,90

9,90

9,90

12,30

DIM

4040065 /E 12/01 NOTES: A. B. C. D.

All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150

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MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30 0,19

0,65 14

0,10 M

8

0,15 NOM 4,50 4,30

6,60 6,20 Gage Plane 0,25

1

7 0°– 8° A

0,75 0,50

Seating Plane 0,15 0,05

1,20 MAX

PINS **

0,10

8

14

16

20

24

28

A MAX

3,10

5,10

5,10

6,60

7,90

9,80

A MIN

2,90

4,90

4,90

6,40

7,70

9,60

DIM

4040064/F 01/97 NOTES: A. B. C. D.

All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153

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• DALLAS, TEXAS 75265

IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products

Applications

Amplifiers

amplifier.ti.com

Audio

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DSP

dsp.ti.com

Broadband

www.ti.com/broadband

Interface

interface.ti.com

Digital Control

www.ti.com/digitalcontrol

Logic

logic.ti.com

Military

www.ti.com/military

Power Mgmt

power.ti.com

Optical Networking

www.ti.com/opticalnetwork

Microcontrollers

microcontroller.ti.com

Security

www.ti.com/security

Telephony

www.ti.com/telephony

Video & Imaging

www.ti.com/video

Wireless

www.ti.com/wireless

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Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright  2005, Texas Instruments Incorporated

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