FAIRCHILD FKPF12N60
January 15, 2018 | Author: Anonymous | Category: N/A
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Description
FKPF12N60 / FKPF12N80
FKPF12N60 / FKPF12N80 Application Explanation • • • •
Switching mode power supply, light dimmer, electric flasher unit, hair drier TV sets, stereo, refrigerator, washing machine Electric blanket, solenoid driver, small motor control Photo copier, electric tool
2 1: T1 2: T2 3: Gate 3 1 2 3
1
TO-220F
Bi-Directional Triode Thyristor Planar Silicon Absolute Maximum Ratings TC=25°C unless otherwise noted Symbol
Rating
Parameter (Note1 )
FKPF12N60 600
Units
FKPF12N80 800
VDRM
Repetitive Peak Off-State Voltage
Symbol IT (RMS)
Parameter RMS On-State Current
Conditions Commercial frequency, sine full wave 360° conduction, TC=82°C
ITSM
Surge On-State Current
I2t
V
Rating 12
Units A
60Hz sinewave 1 full cycle, peak value, non-repetitive
120
A
I2t for Fusing
Value corresponding to 1 cycle of halfwave 60Hz, surge on-state current
60
A2s
di/dt
Critical Rate of Rise of On-State Current
IG = 2x IGT, tr ≤ 100ns
50
A/µs
PGM
Peak Gate Power Dissipation
TC = +80°C, Pulse Width = 1.0µs
5
W
PG (AV)
Average Gate Power Dissipation
TC = +80°C, t = 8.3ms
0.5
W
VGM
Peak Gate Voltage
IGM
Peak Gate Current
Pulse Width ≤ 1.0µsec; TC = 90°C
10
V
2
A
TJ
Junction Temperature
- 40 ~ 125
°C
TSTG
Storage Temperature
- 40 ~ 125
°C
Viso
Isolation Voltage
1500
V
Ta=25°C, AC 1 minute, T1 T2 G terminal to case
Thermal Characteristic Symbol Rth(J-C)
Parameter Thermal Resistance
©2002 Fairchild Semiconductor Corporation
Test Condition Junction to case (Note 4)
Min. -
Typ. -
Max. 3.0
Units °C/W
Rev. A1, December 2002
Symbol IDRM
Parameter Repetieive Peak Off-State Current
VTM
On-State Voltage
VGT
Gate Trigger Voltage (Note 2)
Test Condition
Typ. -
Max. 20
Units µA
-
-
1.5
V
T2(+), Gate (+)
-
-
1.5
V
T2(+), Gate (-)
-
-
1.5
V
T2(-), Gate (-)
-
-
1.5
V
T2(+), Gate (+)
-
-
30
mA
T2(+), Gate (-)
-
-
30
mA
T2(-), Gate (-)
-
-
30
mA
0.2
-
-
V
TC=25°C, ITM=17A Instantaneous measurement I II III
VD=6V, RL=6Ω, RG=330Ω
I Gate Trigger Current (Note 2)
IGT
Min. -
VDRM applied
II III
VD=6V, RL=6Ω, RG=330Ω
VGD
Gate Non-Trigger Voltage
TJ=125°C, VD=1/2VDRM
IH
Holding Current
VD = 12V, ITM = 1A
50
mA
IL
Latching Current
VD = 12V, IG = 1.2IGT
50
mA
I, III II
70 VDRM = Rated, Tj = 125°C, Exponential Rise
dv/dt
Critical Rate of Rise of Off-State Voltag
(dv/dt)C
Critical-Rate of Rise of Off-State Commutating Voltage (Note 3)
300 10
-
mA V/µs
-
V/µs
Notes: 1. Gate Open 2. Measurement using the gate trigger characteristics measurement circuit 3. The critical-rate of rise of the off-state commutating voltage is shown in the table below 4. The contact thermal resistance RTH(c-f) in case of greasing is 0.5 °C/W
VDRM (V)
FKPF12N60
FKPF12N80
Commutating voltage and current waveforms (inductive load)
Test Condition
Supply Voltage
1. Junction Temperature TJ=125°C 2. Rate of decay of on-state commutating current (di/dt)C = - 6.0A/ms 3. Peak off-state voltage VD = 400V
Time (di/dt)C
Main Current
Time
Time
Main Voltage (dv/dt)C
VD
Quadrant Definitions for a Triac T2 Positive + (+) T2
Quadrant II
(+) IGT GATE
(+) T2
Quadrant I
(+) IGT GATE T1
T1
(+) T2
(+) T2
IGT -
Quadrant III
+ IGT
(+) IGT GATE
(+) IGT GATE T1
Quadrant IV T1
T2 Negative
©2002 Fairchild Semiconductor Corporation
Rev. A1, December 2002
FKPF12N60 / FKPF12N80
Electrical Characteristics TC=25°C unless otherwise noted
FKPF12N60 / FKPF12N80
Typical Curves
200
50
SURGE ON-STATE CURRENT [A]
180
ON-STATE CURRENT [A]
40
30
Tj=25℃ Tj=125℃ 20
10
160 140 120 100 80 60 40 20 0
0 0.0
0.5
1.0
1.5
1
2.0
10
Figure 1. Maximum On-state Characteristics
Figure 2. Rated Surge On-state Current
1000
NORMALIZED GATE TRIGGER CURRENT [%]
100
GATE VOLTAGE [V]
VGM=10V PGM=5W
10
PG(AV)=0.5W
IGM=2A
VGT=1.5V
1
0.1 10
IRGTⅠ
VGD=0.2V
IFGTⅠ, IRGTⅢ 100
1000
10000
IFGTⅠ, IRGTⅠ
100
IFGTⅢ
10 -60
-40
-20
GATE CURRENT [mA]
0
20
40
60
80
100
120
140
JUNCTION TEMPERATURE [℃]
Figure 3. Gate Characteristics
Figure 4. Gate Trigger Current vs Tj
1000
10
JUNCTION TO CASE
TRANSIENT THERMAL IMPEDANCE o Rth(j-c) [ C/W]
NORMALIZED GATE TRIGGER VOLTAGE [%]
100
CONDUCTION TIME (CYCLES AT 60Hz)
ON-STATE VOLTAGE [V]
100
10 -60
-40
-20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE [℃]
Figure 5. Gate Trigger Voltage vs Tj
©2002 Fairchild Semiconductor Corporation
140
1
0.1 1E-3
0.01
0.1
1
10
100
TIME [s]
Figure 6. Transient Thermal Impedance
Rev. A1, December 2002
FKPF12N60 / FKPF12N80
Typical Curves (Continues) 160
① NO HEAT SINK ② 30 × 30 × 2 ㎜ AL HEAT SINK ③ 50 × 50 × 2 ㎜ AL HEAT SINK ④ 70 × 70 × 2 ㎜ AL HEAT SINK ⑤ 100 × 100 × 2 ㎜ AL HEAT SINK
120
100
CURVES APPLY REGARDLESS OF CONDUCTION ANGLE
140
CASE TEMPERATURE [℃]
Maximum Allowable Ambient Temperature [℃]
140
80
60
40
120 100 80 60
360° CONDUCTION RESISTIVE, INDUCTIVE LOAD
40
20
②
①
③
④
20
⑤
0 0
2
4
6
8
10
0
12
0
2
4
IT(RMS) [A]
ON STATE POWER DISSIPATION [W]
16
360° CONDUCTION RESISTIVE, INDUCTIVE LOAD
12 10 8 6 4 2 0 0
2
4
6
8
10
12
14
16
10
12
14
16
5
10
TYPICAL EXAMPLE
4
10
3
10
2
10
-60
-40
RMS ON-STATE CURRENT [A]
-20
0
20
40
60
80
100
120
140
JUNCTION TEMPERATURE [V]
Figure 9. Maximum On-state Power Dissipation
Figure 10. Repetitive Peak Off-state Current vs Junction Temperature
1000
1000
TYPICAL EXAMPLE LATCHING CURRENT [mA]
NORMALIZED HOLDING CURRENT [%]
8
Figure 8. Allowable Case Temperature vs Rms On-state Current
NORMALIZED REPETIVITE OFF-STATE CURRENT [%]
Figure 7. Allowable Ambient Temperature vs Rms On-state Current
14
6
RMS ON-STATE CURRENT [A]
100
10 -60
-40
-20
0
20
40
60
80
100
120
140
100
10
1 -60
T2(+), G(-) TYPICAL EXEMPLE
T2(± ), G(+) TYPICAL EXEMPLE
-40
-20
0
20
40
60
80
100
120
JUNCTION TEMPERATURE [℃]
JUNCTION TEMPERATURE
Figure 11. Holding Current vs Junction Temperature
Figure 12. Laching Current vs Junction Temperature
©2002 Fairchild Semiconductor Corporation
140
Rev. A1, December 2002
FKPF12N60 / FKPF12N80
Typical Curves (Continues)
1000
NORMALIZED GATE TRIGGER CURRENT [%]
NORMALIZED BREAKOVER VOLTAGE [%]
160
TYPICAL EXAMPLE 140
120
100
80
60
40
20
0 -60
-40
-20
0
20
40
60
80
100
120
IRGTⅠ IRGTⅢ 100
IFGTⅠ
10 1
140
10
100
GATE CURRENT PULSE WIDTH [uS]
JUNCTION TEMPERATURE [V]
Figure 13. Breakover Voltage vs. Junction Temperature
Figure 14. Gate Trigger Current vs. Gate Current Pulse Width
TYPICAL EXAMPLE Tj=125℃
140
CRITICAL RATE OF RISE OF OFF-STATE COMMUTATING VOLTAGE [V/us]
NORMALIZED BREAKOVER VOLTAGE [%]
160
TYPICAL EXAMPLE Tj = 125℃ IT = 4A τ = 500us VD = 200V f = 3Hz
100
120 100
Ⅰ QUADRANT
80 60
Ⅲ QUADRANT
40 20
Ⅰ QUADRANT
10
Ⅲ QUADRANT 1
0
1
10
2
10
10
3
RATE OF RISE OF-STATE VOLTAGE [V/us]
Figure 15. Breakover Voltage vs. Rate of Rise of Off-State Voltage
©2002 Fairchild Semiconductor Corporation
10
4
10
1
10
2
10
3
10
RATE OF DECAY OF ON-STATE COMMUTATION CURRENT [A/ms]
Figure 16. Commutation Characteristics
Rev. A1, December 2002
FKPF12N60 / FKPF12N80
Package Dimension
3.30 ±0.10
TO-220F 10.16 ±0.20
2.54 ±0.20
ø3.18 ±0.10
(7.00)
(1.00x45°)
15.87 ±0.20
15.80 ±0.20
6.68 ±0.20
(0.70)
0.80 ±0.10 ) 0°
(3
9.75 ±0.30
MAX1.47
#1 +0.10
0.50 –0.05
2.54TYP [2.54 ±0.20]
2.76 ±0.20
2.54TYP [2.54 ±0.20]
9.40 ±0.20
4.70 ±0.20
0.35 ±0.10
Dimensions in Millimeters ©2002 Fairchild Semiconductor Corporation
Rev. A1, December 2002
TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
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PACMAN™ POP™ Power247™ PowerTrench® QFET™ QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ SILENT SWITCHER® SMART START™
SPM™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET® VCX™
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LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life support 1. Life support devices or systems are devices or systems device or system whose failure to perform can be which, (a) are intended for surgical implant into the body, reasonably expected to cause the failure of the life support or (b) support or sustain life, or (c) whose failure to perform device or system, or to affect its safety or effectiveness. when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
©2002 Fairchild Semiconductor Corporation
Rev. I1
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